In today’s rapidly advancing technological landscape, Shenzhen LeaKin Technology Co., Ltd., as a high‑tech enterprise deeply rooted in embedded development, design, and production, has always believed that learning is the best investment—and this belief lies at the very heart of our corporate culture! Recently, our R&D department hosted a truly unique “technological feast”: we invited technical experts from Tianjin Phytium and South Korea’s DEEPX to come to the company for face‑to‑face exchanges and guidance. This wasn’t a formal press conference; rather, it was a heartfelt conversation—much like old friends gathering together to chat about how to make technology more down‑to‑earth and accessible.

On March 12, a special “exhibit” was placed in the conference room of Shenzhen LeaKin Technology: a blue circuit board encased in a transparent housing, clearly emblazoned with the words “DEEPX DX-M1.” This was the very centerpiece of our discussions with DEEPX’s technical experts from South Korea—a high‑performance, low‑power AI inference module. Featuring an M.2 standard interface and integrating a dedicated NPU with high‑speed memory, it can be flexibly deployed in edge devices, delivering plug‑and‑play AI capabilities. During the event, the experts focused on how its architecture supports the efficient execution of multimodal neural networks and how to optimize power efficiency and inference latency in real‑world scenarios, offering our customers fresh hardware-based solutions to challenges such as real‑time requirements and power consumption constraints. Achieving AI-powered performance with low power consumption and high computing power truly embodies the “AI for Everyone & Everywhere” philosophy.

On March 9, our gaze shifted to the large screen at the front of the conference room, where the headline “Next‑Generation Server CPU Tengyun S5000C” stood out in bold. Experts from Tianjin Phytium were meticulously explaining each technical breakthrough: from doubling performance through the adoption of the proprietary FCB62 core, to being the first to support the dramatic bandwidth gains brought by DDR5 and PCIe 5.0; from an enhanced security architecture and native support for national cryptographic algorithms, to sophisticated power management and multi-die packaging technology. These aren’t just theoretical specifications—they are the critical enablers for embedded servers, industrial control systems, and high‑performance computing applications. Our engineers engaged in pragmatic discussions with the experts, focusing on practical implementation details such as IO resource partitioning and thermal design.

This exchange goes far beyond simply “listening to lectures.” We laid out the real-world challenges we’ve encountered in past projects—such as compatibility issues and ecosystem adaptation—and, drawing on the latest technology roadmaps from Phytium and DEEPX, jointly mapped out viable upgrade paths and collaborative development strategies. Whether it’s optimizing the stability of AI modules in complex environments or unleashing the performance of self‑developed CPUs in system integration, our discussions have always revolved around the central question: “How can we make technology better serve our customers’ needs?”

The five core exchange engineers attending the meeting posed for a commemorative photo in front of the company’s iconic wall. In the background, the words “LeaKin Technology” were beautifully juxtaposed with a pair of red Spring Festival couplets; some raised their thumbs in approval, while others clenched their fists in encouragement—no stiff, staged poses here, just the genuine, down-to-earth smiles that tech professionals wear after solving a problem. As we’ve always believed: the true value of technology lies in its application, in collaboration, and in every sincere act of openness and learning.

Walking alongside innovators and embedding technology in real-world scenarios—this is the daily reality of LeaKin Technology, and it’s also the posture we adopt as we move forward.