Regarding the panelization issue in PCB manufacturing.


First, let’s talk about panelization. As we all know, the primary challenge in panelization is to reduce production costs. For PCB panel widths ≤260mm to 300mm, the specific requirements vary depending on the production line. Since we may have a large variety of materials, and each processing machine typically uses one material gun per module, if the panel size exceeds the module’s capacity, the processing speed will slow down dramatically.

The outer frame (clamping edge) of the PCB panel should be carefully designed to ensure that the PCB panel does not deform once it is secured in the fixture. (Generally, V-grooves are not allowed on this edge.) Regarding component placement, first, all components must face the same direction; mirror-image arrangements are strictly prohibited, as they can lead to coordinate positioning issues during processing.

Second, no connectors should protrude at the edges (between the outer frame of the panel and the inner subpanels, as well as between subpanels themselves). If such protrusions exist, they will interfere with the blade separation process after soldering is complete.

To ensure the position and levelness of the inspection board, we need to set up more than three positioning points along the board’s edges. By optically detecting these three points, we can obtain the reference coordinates for the entire machining process as well as the board’s levelness.

The correct practice is to maintain a 5-mm clearance from the edge and to use different spacing when the directions of travel are not aligned (to facilitate distinguishing the entry direction): [When setting reference positioning points, it is customary to leave an unfilled solder mask area around the positioning point that is 1.5 mm larger than the point itself; no similar pads or other similar features should be present.]

Each small board must have at least three positioning holes, with a hole diameter ranging from 3 to 6 mm. Wiring or component placement is not allowed within 1 mm of the edge-positioning holes (to prevent misjudgment).

PCB panelization primarily helps to reduce production and processing costs (and can increase machine processing speeds by several times). An unreasonable design, however, can lead to numerous problems down the line. Therefore, it’s crucial to carefully consider the design in conjunction with SMT processing equipment to prevent potential issues.

Related News


How wide should the process margin be? How should the positioning holes be drilled? Have you got these PCB panel‑design details right?

The process‑edge, alignment holes, and the laser‑etched coding area for in‑vehicle two‑dimensional code traceability on PCB panelization are the fundamental reference points that underpin automated mass production and quality traceability in electronic products. Though they appear to be basic structural elements, they directly determine yield rates, batch-to-batch consistency, and the full‑lifecycle traceability of automotive‑grade components.


Display Interface Technology Explained: Core Differences Between MIPI DSI and LVDS, and a Guide to Application Selection

LVDS interface: Mature technology, low cost, and strong anti-interference performance, making it well-suited for industrial displays, conventional automotive applications, and medium-to-large‑size LCD panels where cost sensitivity is high, resolution requirements are moderate (e.g., 1080p or lower), and complex control commands are not needed. MIPI DSI interface: Offers extremely high bandwidth, very low power consumption, supports high resolutions (2K/4K) and high refresh rates, and provides robust control‑command interaction capabilities. It is ideal for smartphones, high‑end tablets, AR/VR devices, and next‑generation smart terminals with stringent requirements for thinness and low power consumption.


Future Market Analysis Report on Embedded Development

By 2025, China’s embedded market has surpassed RMB 1 trillion in size and is undergoing a paradigm shift—from being a “functional platform” to an “intelligent hub.” Leveraging more than a decade of deep expertise in embedded hardware platforms, particularly its extensive ecosystem integration around Rockchip’s AIoT chips, Shenzhen LeaKin Technology Co., Ltd. has successfully established a leading position in key smart edge segments such as industrial control, AI robotics, and edge computing. Seizing the “golden era” driven by technology democratization, rigid demand, and ecosystem maturation, the company is poised to capitalize on two historic opportunities: first, the market restructuring brought about by domestic substitution; and second, the emergence of entirely new application scenarios enabled by the deep integration of AI and embedded systems. By executing a core strategy centered on “deepening vertical applications, leveraging dual domestic AI engines, and co-building an ecosystem brand,” LeaKin Technology aims to evolve from a premier embedded hardware provider into a critical solutions and ecosystem enabler for the intelligent edge era. The company seeks to secure a leading position in the mid-to-long-tail market segment, which accounts for 55% of the overall market, thereby achieving leapfrog growth.


Analysis, Summary, and Strategic Response Report on the Industry Price-Hike Wave

The wave of price increases is both a biting cold wind and a crucible that tests true strength, weeding out the weak and allowing the strong to prevail. Leveraging 13 years of accumulated expertise as our foundation, guided by a steadfast strategy, and propelled by the conviction of growing together with our customers, LeaKin Technology will proactively rise to the challenge and turn adversity into opportunity. We firmly believe that, through comprehensive value enhancement—both internally and externally—LeaKin Technology, in close partnership with our clients, will not only navigate this cycle safely but, once the tide recedes, emerge even stronger to jointly shape the new market landscape!