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19

2019-06

Common-mode and Differential-mode Signal Analysis

Common-mode and Differential-mode Signal Analysis

2019-06-19

Common-mode and Differential-mode Signal Analysis

28

2019-02

The Nature and Classification of GND，Layout Engineer Technical Training and Customer Communication Guide

The essence of the GND (ground) is to provide a low-impedance return path for the circuit, ensuring that current flows steadily back to the power supply’s negative terminal while also serving as the 0V voltage reference point for various components within the circuit. If the ground design is improper, impedance can cause voltage drops, noise interference, and even signal distortion.

2019-02-28

The Nature and Classification of GND，Layout Engineer Technical Training and Customer Communication Guide

26

2018-09

Shenzhen LeaKin Technology Hardware Engineer Training Tutorial: PCB Design Guide for 100-Ampere Current Ratings

Master the core principles of PCB design for high currents in the hundreds of amperes, including the thermal effects of current, wire resistance calculations, and thermal management techniques. Understand the mechanisms by which different materials and layouts affect current-carrying capacity, and become familiar with the professional standards for industrial-grade high-current designs.

2018-09-26

Shenzhen LeaKin Technology Hardware Engineer Training Tutorial: PCB Design Guide for 100-Ampere Current Ratings

21

2018-03

SMT Core Processes and Practical Handbook for Defect Prevention

This textbook covers comprehensive optimization solutions for the entire process of SMT core technologies, making it suitable for internal training and technical communication with customers. Modern SMT processes are evolving toward intelligence and data-driven approaches. It is recommended that companies adopt SPC statistical process control systems and MES manufacturing execution systems to achieve real-time monitoring and dynamic optimization of process parameters. By strictly implementing the technical specifications and quality control measures outlined in this textbook, SMT production yield can be significantly improved, quality costs reduced, and market competitiveness enhanced. These proven process control methods are particularly crucial in high-reliability application areas such as automotive electronics and medical devices.

2018-03-21

SMT Core Processes and Practical Handbook for Defect Prevention

06

2014-02

A Comprehensive Guide to Preventing and Controlling PCB Warping: A Holistic Solution from Design to Production

In the PCB manufacturing industry, board warpage is a widespread issue that significantly impacts product quality. According to IPC-6012, "Qualification and Performance Specification for Rigid Printed Boards," the maximum allowable warpage and twist for surface-mount printed boards is 0.75%, while other types of boards are permitted up to 1.5%. In practical applications, different scenarios have even stricter requirements: most SMT assembly processes require warpage to be within the range of 0.70% to 0.75%, BGA boards demand warpage below 0.5%, and some high-end electronics manufacturers even set the requirement as low as 0.3%.

2014-02-06

A Comprehensive Guide to Preventing and Controlling PCB Warping: A Holistic Solution from Design to Production

10

2014-01

Core PCB Board Electrical Parameter Analysis and Industrial-Grade Application Guide

In the design of industrial-grade and higher-performance electronic products characterized by high speed, high density, and high reliability, printed circuit board (PCB) substrates are no longer merely simple interconnection carriers. Instead, their electrical parameters, thermal performance, and reliability directly determine the performance limits and long-term stability of the final product. To help you quickly develop a systematic understanding, the table below summarizes the most critical electrical parameters of PCB substrates and their design implications.

2014-01-10

Core PCB Board Electrical Parameter Analysis and Industrial-Grade Application Guide
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LEAKIN International (Hong Kong) Co.,Limited

Contact：

Manager Liu

Phone：

13714204032

Fax：

+86 0755-2357 5852

Email：

sales@lea-kin.com

R&D Base：

Unit 804-805, Building 1, COFCO Yunjing Plaza, Heshuikou Community, Matian Subdistrict, Guangming District, Shenzhen City

PCB Base：

Building C and D, Baishixia Industrial Zone, Jian'an Road, Fuhai Subdistrict, Bao'an District, Shenzhen City

Patch Base：

Building 12, 4th Floor, Sha’er Lantian Science and Technology Park, Ditang Road, Shajing Town, Bao’an District, Shenzhen City

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