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16

2025-10

Deepen strategic cooperation and jointly pioneer a smart future.

Recently, a delegation from our key Korean partner—our steadfast collaborator of the past four years—made a special visit to the R&D center of Shenzhen LeaKin Technology Co., Ltd. for a full-day intensive technical exchange and business discussion. This visit focused on the joint development of next-generation smart glasses tailored specifically for fire commanders, as well as collaborative efforts in critical PCBA manufacturing. This marks a comprehensive upgrade of our partnership—from a long-term collaboration to a “strategic community of joint R&D and manufacturing.”

2025-10-16

Deepen strategic cooperation and jointly pioneer a smart future.

16

2025-08

Go deep into the front lines, fostering technological resonance.

To gain a deeper understanding of industry needs and showcase the latest achievements in domestically produced chip technology, Mr. Liu Jianchao, Deputy General Manager of Operations, and Mr. Wei Pengwen, Deputy General Manager of Technology, at Shenzhen LeaKin Technology Co., Ltd., traveled to North China at the end of July, bringing along the self-developed Rockchip RK series core boards and development boards. During this trip, they conducted a series of important customer visits and technical exchanges. The itinerary covered numerous leading enterprises and research institutions in Beijing, Tianjin, and Zhuozhou, aiming to strengthen the foundation of cooperation through face-to-face, in-depth communication and jointly explore innovative applications in domestic embedded development.

2025-08-16

Go deep into the front lines, fostering technological resonance.

09

2025-06

Deeply collaborate with Xincun Technology to jointly create embedded intelligent manufacturing.

Recently, Shenzhen Hengruiding Electronics Co., Ltd. and Shenzhen Xincun Technology Co., Ltd. (brand: onmsk) jointly announced that they have officially signed a distribution authorization agreement. Under this agreement, Hengruiding Electronics has obtained official authorization from Xincun Technology to distribute the latter’s entire product line in China, with the authorization period running from June 5, 2025, to June 5, 2027. This collaboration goes far beyond the traditional supplier-demand relationship, marking a new stage for the two companies as they move toward “healthy symbiosis and collaborative innovation.”

2025-06-09

Deeply collaborate with Xincun Technology to jointly create embedded intelligent manufacturing.

01

2025-05

Healthy coexistence, jointly building high-end embedded storage.

In today’s rapidly evolving embedded technology landscape, no single enterprise can possibly handle the entire industrial chain on its own. Instead, healthy symbiosis and technological sharing across the upstream and downstream segments of the industry have become the core driving force behind industry advancement. Recently, our company has welcomed an important collaboration: Shenzhen Hengruiding Electronics Co., Ltd.—a company with deep expertise in embedded solutions (and a sister company of Leakin Technology)—has officially announced a strategic partnership with Pusitech (Shenzhen) Co., Ltd., a renowned player in the storage chip sector. Together, the two companies will focus on the high-end embedded market, leveraging their respective strengths and resources to deliver comprehensive storage solutions that offer superior performance, enhanced operational stability, and greater data security to customers worldwide.

2025-05-01

Healthy coexistence, jointly building high-end embedded storage.

10

2025-04

From PCB manufacturing to a one-stop strategic partnership for software and hardware services—another upgrade.

Recently, LeaKin Technology reviewed its deepened collaboration with Honeywell, a Fortune Global 500 company, which began in 2015. Over the past eight years, LeaKin Technology has consistently provided Honeywell with supporting production services for small-batch and highly complex development boards, leveraging its sophisticated process technologies and reliable delivery capabilities in the PCB manufacturing field. Gradually, LeaKin Technology has expanded its offerings to include SMT assembly, chip substitution and adaptation, and even integrated software-and-hardware solutions, thereby becoming one of Honeywell’s key R&D and manufacturing partners in China.

2025-04-10

From PCB manufacturing to a one-stop strategic partnership for software and hardware services—another upgrade.

12

2025-03

A Brief Analysis of the Differentiation and Selection of Storage Chip Functions

In the current wave of technological advancement, storage chips serve as both the “paper” and the “workbench” of the digital world, with the evolution of their technology roadmap directly determining the performance ceiling of entire systems. To help readers develop a systematic understanding of storage technologies, this textbook provides an in-depth analysis of the various sub‑segments within the storage chip landscape, comprehensively covering everything from underlying classifications and technical principles to key parameters and application scenarios—offering robust technical support for product development, market expansion, and customer service.

2025-03-12

A Brief Analysis of the Differentiation and Selection of Storage Chip Functions
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LEAKIN International (Hong Kong) Co.,Limited

Contact：

Manager Liu

Phone：

13714204032

Fax：

+86 0755-2357 5852

Email：

sales@lea-kin.com

R&D Base：

Unit 804-805, Building 1, COFCO Yunjing Plaza, Heshuikou Community, Matian Subdistrict, Guangming District, Shenzhen City

PCB Base：

Building C and D, Baishixia Industrial Zone, Jian'an Road, Fuhai Subdistrict, Bao'an District, Shenzhen City

Patch Base：

Building 12, 4th Floor, Sha’er Lantian Science and Technology Park, Ditang Road, Shajing Town, Bao’an District, Shenzhen City

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