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13

2015-03

Microcontroller Bit-Width Selection and Architecture Analysis

The unified R&D team has aligned its understanding of the microcontroller (MCU) core architecture, dispelled the technical misconception that “only bit count matters,” and established an engineering‑level component selection approach grounded in “performance matching, cost control, and stability and reliability.”

2015-03-13

14

2015-01

Analysis of High-End Chip BGA Packaging Technology and Application Selection

BGA packaging represents not only a change in physical form but also an inevitable outcome of the semiconductor industry’s evolution toward higher density and superior performance. As engineering professionals at Lingkun Technology, a deep understanding of BGA’s technical characteristics enables us to make more informed architectural decisions during the early stages of product design, thereby raising the performance ceiling and enhancing production‑level reliability from the very outset.

2015-01-14

23

2014-10

High-Speed Signal Return Path Design and a Practical Guide to Avoiding Common Pitfalls

In high-speed PCB design, we often focus on impedance control, termination matching, and chip performance, while overlooking the “invisible cornerstone” directly beneath the signal traces: the reference plane. In many cases, an inconspicuous gap in the ground plane is precisely what degrades signal integrity or causes EMI test results to exceed limits. This guide aims to delve into the underlying physical mechanisms, thoroughly analyzing the design principles and common pitfalls of high-speed signal return paths, helping you mitigate risks at the source and enhance the high‑performance hardware of Leakin Technology products.

2014-10-23

High-Speed Signal Return Path Design and a Practical Guide to Avoiding Common Pitfalls

06

2014-02

A Comprehensive Guide to Preventing and Controlling PCB Warping: A Holistic Solution from Design to Production

In the PCB manufacturing industry, board warpage is a widespread issue that significantly impacts product quality. According to IPC-6012, "Qualification and Performance Specification for Rigid Printed Boards," the maximum allowable warpage and twist for surface-mount printed boards is 0.75%, while other types of boards are permitted up to 1.5%. In practical applications, different scenarios have even stricter requirements: most SMT assembly processes require warpage to be within the range of 0.70% to 0.75%, BGA boards demand warpage below 0.5%, and some high-end electronics manufacturers even set the requirement as low as 0.3%.

2014-02-06

A Comprehensive Guide to Preventing and Controlling PCB Warping: A Holistic Solution from Design to Production

10

2014-01

Core PCB Board Electrical Parameter Analysis and Industrial-Grade Application Guide

In the design of industrial-grade and higher-performance electronic products characterized by high speed, high density, and high reliability, printed circuit board (PCB) substrates are no longer merely simple interconnection carriers. Instead, their electrical parameters, thermal performance, and reliability directly determine the performance limits and long-term stability of the final product. To help you quickly develop a systematic understanding, the table below summarizes the most critical electrical parameters of PCB substrates and their design implications.

2014-01-10

Core PCB Board Electrical Parameter Analysis and Industrial-Grade Application Guide

30

2013-12

Regarding the panelization issue in PCB manufacturing.

First, let’s talk about panelization. As we all know, the primary challenge in panelization is to reduce production costs. For PCB panel widths ≤260mm to 300mm, the specific requirements vary depending on the production line. Since we may have a large variety of materials, and each processing machine typically uses one material gun per module, if the panel size exceeds the module’s capacity, the processing speed will slow down dramatically.

2013-12-30

Regarding the panelization issue in PCB manufacturing.
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LEAKIN International (Hong Kong) Co.,Limited

Contact：

Manager Liu

Phone：

13714204032

Fax：

+86 0755-2357 5852

Email：

sales@lea-kin.com

R&D Base：

Unit 804-805, Building 1, COFCO Yunjing Plaza, Heshuikou Community, Matian Subdistrict, Guangming District, Shenzhen City

PCB Base：

Building C and D, Baishixia Industrial Zone, Jian'an Road, Fuhai Subdistrict, Bao'an District, Shenzhen City

Patch Base：

Building 12, 4th Floor, Sha’er Lantian Science and Technology Park, Ditang Road, Shajing Town, Bao’an District, Shenzhen City

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