FLASH and DRAM
FLASH and DRAM
FLASH and DRAM
FLASH and DRAM
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  • FLASH and DRAM
  • FLASH and DRAM
  • FLASH and DRAM
  • FLASH and DRAM

FLASH and DRAM

LeaKin Technology’s long-term partner, Plusetech Technology (Shenzhen) Co., Ltd., is a manufacturer and supplier specializing in the R&D, production, and sales of FLASH and DRAM circuits. Our main product categories are summarized below; for specific product details, please contact our Manager Liu at 13714204032 or via email at andy@lea-kin.com.

Product Description

LeaKin Technology’s long-term partner, Plusetech Technology (Shenzhen) Co., Ltd., is a manufacturer and supplier whose core business focuses on the R&D, production, and sales of FLASH and DRAM circuits. The company’s main product categories are summarized below; for specific product details, please contact our Manager Liu at 13714204032 or via email at sales@lea-kin.com.

Product CategoryCore ValuesKey parametersTarget market
SD NAND (SLC)Ultimate ReliabilitySLC architecture, 100,000 erase/write cycles, wide temperature rangeIndustrial Control, Automotive Electronics, Power Systems, Harsh Environments
eMMCLarge capacity, easy to useStandard package, integrated controller, easy to develop.Smart commercial displays, in-vehicle infotainment, smart home systems, network devices
DDR3/4Performance and Cost-EffectivenessDifferent generations meet diverse performance requirements.Broad-based markets in industry, communications, and consumer electronics
LPDDR4/4XHigh performance, low power consumptionLow voltage, high bandwidth, small sizeHigh-end portable devices, in-vehicle systems, AI edge computing

Plusetech’s product portfolio is clearly structured and precisely addresses the core needs of embedded systems—from storage (SD NAND / eMMC) to memory (DDR / LPDDR). By offering products at various technology levels (such as SLC vs. eMMC) and across different generations (such as DDR3 vs. LPDDR4), they can provide comprehensive solutions for a wide range of application scenarios with varying degrees of complexity and requirements.

The SD NAND (SLC) product line is Plusetech’s core offering in the high-reliability sector.

Part NumberStorage capacityStorage structureOperating voltageNumber of erase/write cyclesProduct packagingProduct dimensionsOperating temperature
PSSD01G-LK1 Gbit (128 MB)SLC3.3VOver 100,000 timesLGA-88.0 x 6.0 mm-30°C to 85°C
PSSD02G-LK2 Gbit (256 MB)SLC3.3VOver 100,000 timesLGA-88.0 x 6.0 mm-30°C to 85°C
PSSD04G-LK4 Gbit (512 MB)SLC3.3VOver 100,000 timesLGA-88.0 x 6.0 mm-30°C to 85°C
PSSD32G-DS32 Gbit (4 GB)SLC3.3VOver 100,000 timesLGA-88.0 x 6.2 mm-30°C to 85°C
PSSD64G-DS64 Gbit (8 GB)SLC3.3VOver 100,000 timesLGA-88.0 x 7.0 mm-30°C to 85°C

 

Detailed Overview of the eMMC Product Line

Part NumberStorage capacityStorage structureOperating voltageNumber of erase/write cyclesProduct packagingProduct dimensionsOperating temperature
PS04MAAJ-MYD4 GBThe mainstream is TLC.3.3V (interface) / 1.8V (optional)Typical value: 3,000 times153-ball FBGA11.5 mm x 13.0 mm-25°C to 85°C
PS08MAAJ-MYD8 GBThe mainstream is TLC.3.3V (interface) / 1.8V (optional)Typical value: 3,000 times153-ball FBGA11.5 mm x 13.0 mm-25°C to 85°C

 

DDR Product Line Architecture Analysis

DDR products span multiple generations to meet diverse requirements for performance, power consumption, and cost.

Product CategorySpecific categoriesOperating voltageMain featuresTypical application scenarios
DDR3Standard DDR31.5VHigh cost performance, mature and stable, with a long supply chain.Cost-sensitive traditional industrial control and network communication equipment.
 Low Voltage DDR3L1.35VPower consumption is reduced by approximately 20% compared to DDR3.Portable devices and battery-powered devices that emphasize power consumption.
DDR4Standard DDR41.2VHigher speed, higher density, and superior performance compared to DDR3.Next-generation industrial control computers, servers, and high-end network equipment.
LPDDR4/4XLow Power Double Data Rate 41.1V / 0.6VUltra-low power consumption, high bandwidth, small package.Scenarios with stringent requirements for power consumption and size, such as in-vehicle systems, high-end tablets, and AIoT edge computing devices.

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