FLASH and DRAM
Product Description
LeaKin Technology’s long-term partner, Plusetech Technology (Shenzhen) Co., Ltd., is a manufacturer and supplier whose core business focuses on the R&D, production, and sales of FLASH and DRAM circuits. The company’s main product categories are summarized below; for specific product details, please contact our Manager Liu at 13714204032 or via email at sales@lea-kin.com.
| Product Category | Core Values | Key parameters | Target market |
|---|---|---|---|
| SD NAND (SLC) | Ultimate Reliability | SLC architecture, 100,000 erase/write cycles, wide temperature range | Industrial Control, Automotive Electronics, Power Systems, Harsh Environments |
| eMMC | Large capacity, easy to use | Standard package, integrated controller, easy to develop. | Smart commercial displays, in-vehicle infotainment, smart home systems, network devices |
| DDR3/4 | Performance and Cost-Effectiveness | Different generations meet diverse performance requirements. | Broad-based markets in industry, communications, and consumer electronics |
| LPDDR4/4X | High performance, low power consumption | Low voltage, high bandwidth, small size | High-end portable devices, in-vehicle systems, AI edge computing |
Plusetech’s product portfolio is clearly structured and precisely addresses the core needs of embedded systems—from storage (SD NAND / eMMC) to memory (DDR / LPDDR). By offering products at various technology levels (such as SLC vs. eMMC) and across different generations (such as DDR3 vs. LPDDR4), they can provide comprehensive solutions for a wide range of application scenarios with varying degrees of complexity and requirements.
The SD NAND (SLC) product line is Plusetech’s core offering in the high-reliability sector.
| Part Number | Storage capacity | Storage structure | Operating voltage | Number of erase/write cycles | Product packaging | Product dimensions | Operating temperature |
|---|---|---|---|---|---|---|---|
| PSSD01G-LK | 1 Gbit (128 MB) | SLC | 3.3V | Over 100,000 times | LGA-8 | 8.0 x 6.0 mm | -30°C to 85°C |
| PSSD02G-LK | 2 Gbit (256 MB) | SLC | 3.3V | Over 100,000 times | LGA-8 | 8.0 x 6.0 mm | -30°C to 85°C |
| PSSD04G-LK | 4 Gbit (512 MB) | SLC | 3.3V | Over 100,000 times | LGA-8 | 8.0 x 6.0 mm | -30°C to 85°C |
| PSSD32G-DS | 32 Gbit (4 GB) | SLC | 3.3V | Over 100,000 times | LGA-8 | 8.0 x 6.2 mm | -30°C to 85°C |
| PSSD64G-DS | 64 Gbit (8 GB) | SLC | 3.3V | Over 100,000 times | LGA-8 | 8.0 x 7.0 mm | -30°C to 85°C |
Detailed Overview of the eMMC Product Line
| Part Number | Storage capacity | Storage structure | Operating voltage | Number of erase/write cycles | Product packaging | Product dimensions | Operating temperature |
|---|---|---|---|---|---|---|---|
| PS04MAAJ-MYD | 4 GB | The mainstream is TLC. | 3.3V (interface) / 1.8V (optional) | Typical value: 3,000 times | 153-ball FBGA | 11.5 mm x 13.0 mm | -25°C to 85°C |
| PS08MAAJ-MYD | 8 GB | The mainstream is TLC. | 3.3V (interface) / 1.8V (optional) | Typical value: 3,000 times | 153-ball FBGA | 11.5 mm x 13.0 mm | -25°C to 85°C |
DDR Product Line Architecture Analysis
DDR products span multiple generations to meet diverse requirements for performance, power consumption, and cost.
| Product Category | Specific categories | Operating voltage | Main features | Typical application scenarios |
|---|---|---|---|---|
| DDR3 | Standard DDR3 | 1.5V | High cost performance, mature and stable, with a long supply chain. | Cost-sensitive traditional industrial control and network communication equipment. |
| Low Voltage DDR3L | 1.35V | Power consumption is reduced by approximately 20% compared to DDR3. | Portable devices and battery-powered devices that emphasize power consumption. | |
| DDR4 | Standard DDR4 | 1.2V | Higher speed, higher density, and superior performance compared to DDR3. | Next-generation industrial control computers, servers, and high-end network equipment. |
| LPDDR4/4X | Low Power Double Data Rate 4 | 1.1V / 0.6V | Ultra-low power consumption, high bandwidth, small package. | Scenarios with stringent requirements for power consumption and size, such as in-vehicle systems, high-end tablets, and AIoT edge computing devices. |
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