To gain a deeper understanding of industry needs and showcase the latest achievements in domestically produced chip technology, Mr. Liu Jianchao, Deputy General Manager of Operations, and Mr. Wei Pengwen, Deputy General Manager of Technology, at Shenzhen LeaKin Technology Co., Ltd., traveled to the North China region at the end of July, bringing along the self-developed Rockchip RK series core boards and development boards. During this trip, they conducted a series of important customer visits and technical exchanges. The itinerary covered numerous leading enterprises and research institutions in Beijing, Tianjin, and Zhuozhou, with the aim of strengthening cooperative foundations through face-to-face, in-depth communication and jointly exploring innovative applications in domestic embedded development.

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Our first stop on the visit was Aisino Corporation, located in Zhuozhou. In the showroom adorned with the “Aisino” logo (as shown in Figure 1), the teams from both sides took a warm and friendly group photo, marking the official start of our exchange. The “Aisino Large Model All-in-One Machine” displayed in the customer’s showroom (as shown in Figure 2) sparked lively discussions. Its integrated approach—combining computing power with application development—strongly complements LeaKin Technology’s strategic focus on providing robust support through underlying hardware and core modules. The customer expressed high appreciation for LeaKin’s profound expertise in low-level development on the RK chip platform, believing that this capability provides a critical hardware foundation for the efficient and secure deployment of AI applications.

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The subsequent discussion delved into specific technical and project scenarios. In the conference room (as shown in Figure 3), the client’s technical experts carefully examined the development boards and core board samples provided by LeaKin Technology. These boards, meticulously protected within red antistatic foam, were not merely products—they served as the starting point for a technical dialogue. Seated around the table, both sides conducted a detailed analysis and discussion, addressing everything from specific hardware interface definitions and performance boundaries to the practical challenges currently encountered in software porting and driver optimization. Deputy General Manager Liu Jianchao explained, from both product and market perspectives, the strategic layout and value of domestic substitution, while Deputy General Manager Wei Pengwen offered clear solution-oriented insights from the perspective of technical implementation pathways.

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The exchange wasn't confined to the conference room. In the customer’s workspace and laboratory (as shown in Figure 4), engineers directly performed power-up debugging and demonstrations of the development boards. The LeaKin technical team was on-site to address a range of practical questions related to system startup, peripheral driver development, power consumption optimization, and more. This seamless transition—from brainstorming on the conference-room whiteboard to code debugging at the lab bench—fully underscores the depth and pragmatism of the technical exchange. In the relaxed lounge area, casual conversations about industry trends and ecosystem development further bridged the gap between the two sides (as shown in Figure 5).

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This trip to North China was a solid, in-depth technical tour. We were greatly encouraged by our customers’ admiration for the rapid pace of technological iteration in domestically produced chips, as well as their recognition of LeaKin Technology’s deep-rooted expertise and remarkable achievements in specific fields. At the same time, the detailed requirements raised by our customers in complex scenarios have clearly pointed the way for us to continuously optimize our products. We deeply realize that, against the backdrop of the nation’s drive toward scientific and technological self-reliance and strength, it is LeaKin Technology’s mission to work hand-in-hand with our customers—leveraging robust technology and swift responsiveness—to jointly overcome the “bottleneck” challenges. We look forward to taking this visit as a new starting point, collaborating closely with all our partners to create even greater value in the vast and promising landscape of domestically developed embedded applications.