Recently, a delegation from our key Korean partner—our steadfast collaborator of the past four years—made a special visit to the R&D center of Shenzhen LeaKin Technology Co., Ltd. for a full-day intensive technical exchange and business discussion. This visit focused on the joint development of next-generation smart glasses tailored specifically for fire commanders, as well as collaborative efforts in critical PCBA manufacturing. This marks a comprehensive upgrade of our partnership—from a long-term collaboration to a “strategic community of joint R&D and manufacturing.”

In the company’s conference room, teams from both sides engaged in a lively and professional discussion centered around the key theme of “Development of Equipment for Fire Commanders” (#소방 지의관용 기기 개발). The project’s conceptual diagrams and design ideas were clearly displayed on the meeting screen. Led by Mr. Liu Jianchao, our Vice President of Operations, and Mr. Wei Pengwen, our Vice President of Technology, our core technical team conducted a comprehensive alignment and exchange with the client’s experts on product feature definitions, technical challenges, and potential market application scenarios. The blueprints spread out on the table, the equipment laid out before us, and the focused figures diligently taking notes—all together painted a vivid picture of close collaboration and shared commitment to innovation.

Against the backdrop of evolving global supply chain dynamics and industrial upgrading, customers have clearly pointed out that China’s consistently stable development environment, its comprehensive and efficient industrial chain system, and the rapidly emerging domestic high-end chip technology are key factors driving their deepened cooperation in China and the shift of R&D and manufacturing focus toward the country. LeaKin Technology has precisely seized this historic opportunity by leveraging domestically produced high-performance chip platforms such as Rockchip, deeply investing in foundational technologies, and successfully developing a full range of core boards and industry-specific solutions covering multiple application scenarios. As a result, the company has established significant advantages in modular development and rapid delivery.

During the negotiation, our technical team focused on showcasing and explaining a highly integrated solution tailored specifically for smart glasses devices (the relevant prototype is shown in the figure). This solution fully leverages our core board’s powerful capabilities in miniaturization, low power consumption, high-performance computing, and graphics processing, enabling it to seamlessly support complex requirements such as AR information display, environmental data sensing, and real-time communication. As a result, it has earned high praise from our client. The client also highly commended our company’s vertically integrated capabilities—from chip-level development all the way to complete device design—as well as our responsive engineering support system.

Building on the mutual trust established thus far and the deep consensus reached during this exchange, both parties have jointly set forth clear strategic goals: taking this smart glasses project as a fresh starting point, we will deeply integrate our respective strengths in technology R&D and market insights to forge an even stronger and more exclusive partnership. Together, we will pioneer the high-end professional smart wearable device market and strive to elevate the annual scale of our collaboration on this product line to a new level.

This visit was not only a successful exchange of technology and business insights but also strong evidence of LeaKin Technology’s commitment to independent innovation and its deep-rooted expertise in industry applications. It highlights the company’s leading position and value in the wave of domestically developed technologies. Looking ahead, LeaKin Technology will continue to work hand-in-hand with global partners, leveraging cutting-edge technology, stable products, and reliable services to overcome technological challenges, seize development opportunities, and jointly build a smart future.