Company News_Shenzhen LeaKin Technology Co., Ltd.

Phone: 13714204032 Fax: +86 0755-23575852 Email:sales@lea-kin.com

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2013-10

Analysis of Copper Thickness Parameters and Current-Carrying Capacity

In PCB (printed circuit board) design, copper thickness is not only a fundamental parameter for defining manufacturing specifications but also a critical metric that determines the product’s electrical performance, thermal management, and long-term reliability. To help our in‑house engineers elevate their design expertise and to enable customers to better understand PCB fabrication processes, Leakin Technology has specially prepared this technical guide. We liken the copper foil in a PCB to a “highway” for electron flow, systematically dissecting how copper thickness impacts current‑carrying capacity, thereby providing expert guidance for developing high‑performance, highly reliable electronic products.

2013-10-10

Analysis of Copper Thickness Parameters and Current-Carrying Capacity

20

2013-09

A Brief Overview of Various Electronic Components and Their Functions

Brief Analysis of Common Electronic Components

2013-09-20

A Brief Overview of Various Electronic Components and Their Functions

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LEAKIN International (Hong Kong) Co.,Limited

Contact：

Manager Liu

Phone：

Fax：

+86 0755-2357 5852

Email：

sales@lea-kin.com

R&D Base：

Unit 804-805, Building 1, COFCO Yunjing Plaza, Heshuikou Community, Matian Subdistrict, Guangming District, Shenzhen City

PCB Base：

Building C and D, Baishixia Industrial Zone, Jian'an Road, Fuhai Subdistrict, Bao'an District, Shenzhen City

Patch Base：

Building 12, 4th Floor, Sha’er Lantian Science and Technology Park, Ditang Road, Shajing Town, Bao’an District, Shenzhen City

Website Construction: Zhongqi Dongli

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Tel：13714204032

Email：sales@lea-kin.com